LED Laser Scriber
Mirle LED laser scriber can perform high aspect ratio cutting on 2–4" LED sapphire substrate or wafer coated with metal on the back. Wafer size and orientation detection and automatic laser power adjustment functions are provided. It can produce high lumen LEDs and is a highly stable and fully automatic machine.
Since the founding of Mirle, we have always employed the strategy of "steady growth" and established...
Zip code 3000076 No.3, R&D Rd. II, Science Park, Hsinchu, 30076, Taiwan, R.O.C 新竹県