Robotic Application System
Optronic Industry-Glass Substrate Packaging/Unpackaging
As panels get larger, the packaging work of these large panels becomes more important. With years of experience in cooperating with LCD companies, our robotic system can pack/unpack G5.5-G8.5 panels.
| Usage | Applications •LCD •LCM |
|---|---|
| URL | http://www.mirle.com.tw/webe/html/product/show.aspx?num=368&kind=98 |
Company information
Mirle Automation Corporation.
Since the founding of Mirle, we have always employed the strategy of "steady growth" and established...
Zip code 3000076 No.3, R&D Rd. II, Science Park, Hsinchu, 30076, Taiwan, R.O.C 新竹県